Overview

Packaged & bare die

Our comprehensive MMIC and ASIC semiconductor capabilities provide wafer, die and packaged products from dedicated global partners using technologies including LCP, GaN, GaAs, Si, SOI and MEMS.

With decades of success in the world of surface mount technology within a variety of programmes, our heritage, knowledge and expertise are at your disposal from initial concept development and supply of PDKs & models, EVKs, evaluation of catalogue products to establishing screening controls and inventory management at production stages.

More about Surface Mount Components

Hi-Rel & high frequency

Our frequency capability ranges from DC to 110GHz allowing us to support our many clients in the industrial, commercial, defence and space sectors looking for superior performance in noise, power throughput in Hi-Rel environments. With design and manufacturing centres of excellence located globally in the US, UK, France, Germany, India, Malaysia and South-Korea we are well positioned to be your strategic partner.

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